TSC2001, TSC2003, TSC20031PW Selling Leads, Datasheet
MFG:N/A Package Cooled:PLCC-28 D/C:99
TSC2001, TSC2003, TSC20031PW Datasheet download
Part Number: TSC2001
MFG: N/A
Package Cooled: PLCC-28
D/C: 99
MFG:N/A Package Cooled:PLCC-28 D/C:99
TSC2001, TSC2003, TSC20031PW Datasheet download
MFG: N/A
Package Cooled: PLCC-28
D/C: 99
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PDF/DataSheet Download
Datasheet: TSC 80251A1
File Size: 953706 KB
Manufacturer: Atmel
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TSC2003
File Size: 427971 KB
Manufacturer: TI [Texas Instruments]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TSC 80251A1
File Size: 953706 KB
Manufacturer: Atmel
Download : Click here to Download
The TSC2003 is a 4-wire resistive touch screen controller. It also features direct measurement of two batteries, two auxiliary analog inputs, temperature measurement, and touchpressure measurement.
The TSC2003 has an on-chip 2.5V reference that can be utilized for the auxiliary inputs, battery monitors, and temperature- measurement modes. The reference can also be powered down when not used to conserve power. The
internal reference will operate down to 2.7V supply voltage while monitoring the battery voltage from 0.5V to 6V.
The TSC2003 is available in the small TSSOP-16 and VFBGA-48 packages and is specified over the 40°C to +85°C temperature range.
+VDD to GND ........................................... 0.3V to +6V
Digital Input Voltage to GND ..... . 0.3V to +VDD + 0.3V
Analog Input Voltage to GND.
All Pins Except 7, 8 ...... ................0.3V to +VDD + 0.3V
Analog Input Voltage Pins 7, 8 to GND ...0.3V to +6.0V
Operating Temperature Range ..........40°C to +85°C
Storage Temperature Range ...........65°C to +150°C
Power Dissipation ............................ (TJ Max TA)/ JA
TSSOP Package
Junction Temperature (TJ Max) .................... +150°C
JA Thermal Impedance ........................ +115.2°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ........................................+215°C
Infrared (15s) .............................................. +220°C
VFBGA Package
Junction Temperature (TJ Max) .................... +125°C
JA Thermal Impedance ..............................+50°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ........................................+215°C
Infrared (15s) .............................................. +220°C
NOTE:
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability.