Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
The TPA3107D2 is a 15-W (per channel) efficient, Class-D audio power amplifier for driving bridged-tied stereo speakers.
The TPA3107D2 can drive stereo speakers as low as 6 W. The high efficiency of the TPA3107D2, 87%, eliminates the need for an external heat sink when playing music.
The gain of the amplifier is controlled by two gain select pins. The gain selections are 20, 26, 32, 36 dB.
The outputs are fully protected against shorts to GND, VCC, and output-to-output shorts with an auto recovery feature and monitor output.
TPA3107D2 Maximum Ratings
UNIT
0.3 V to 30 V
VCC Supply voltage
AVCC, PVCC
0.3 V to VCC + 0.3 V
VI Input voltage
SHUTDOWN, MUTE
0.3 V to VREG + 0.5 V
GAIN0, GAIN1, RINN, RINP, LINN, LINP, MSTR/SLV, SYNC
See Dissipation Rating Table
Continuous total power dissipation
40 to 85
TA Operating free-air temperature range
40 to 150
TJ Operating junction temperature range(2)
65 to 150
Tstg Storage temperature range
Human body model (3) (all pins)
±2 kV
Electrostatic discharge
Charged-device model (4) (all pins)
±500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The TPA3107D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad. (3) In accordance with JEDEC Standard 22, Test Method A114-B. (4) In accordance with JEDEC Standard 22, Test Method C101-A
TPA3107D2 Features
· 15-W/ch into an 8-W Load From a 16-V Supply · Operates from 10 V to 26 V · Efficient Class-D Operation Eliminates the Need for Heat Sinks · Four Selectable, Fixed Gain Settings · Differential Inputs · Thermal and Short-Circuit Protection With Auto Recovery Feature · Clock Output for Synchronization With Multiple Class-D Devices · Surface Mount 10 mm ´ 10 mm, 64-pin HTQFP Package