TOP220YAI, TOP221, TOP221-227 Selling Leads, Datasheet
MFG:NO Package Cooled:DIP-8 D/C:09+
TOP220YAI, TOP221, TOP221-227 Datasheet download
Part Number: TOP220YAI
MFG: NO
Package Cooled: DIP-8
D/C: 09+
MFG:NO Package Cooled:DIP-8 D/C:09+
TOP220YAI, TOP221, TOP221-227 Datasheet download
MFG: NO
Package Cooled: DIP-8
D/C: 09+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: TOP100
File Size: 170771 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TOP221
File Size: 179892 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TOP100
File Size: 170771 KB
Manufacturer:
Download : Click here to Download
The second generation TOPSwitch-II family is more cost effective and provides several enhancements over the first generation TOPSwitch family. The TOPSwitch-II family extends the power range from 100W to 150W for 100/115/230 VAC input and from 50W to 90W for 85-265 VAC universal input. This brings TOPSwitch technology advantages to many new applications, i.e. TV, Monitor, Audio amplifiers, etc. Many significant circuit enhancements that reduce the sensitivity to board layout and line transients now make the design even easier. The standard 8L PDIP package option reduces cost in lower power, high efficiency applications. The internal lead frame of this package uses six of its pins to transfer heat from the chip directly to the board, eliminating the cost of a heat sink. TOPSwitch incorporates all functions necessary for a switched mode control system into a three terminal monolithic IC: power MOSFET, PWM controller, high voltage start up circuit, loop compensation and fault protection circuitry.
The second generation TOPSwitch-II family is more cost effective and provides several enhancements over the first generation TOPSwitch family. The TOPSwitch-II family extends the power range from 100W to 150W for 100/115/230 VAC input and from 50W to 90W for 85-265 VAC universal input. This brings TOPSwitch technology advantages to many new applications, i.e. TV, Monitor, Audio amplifiers, etc. Many significant circuit enhancements that reduce the sensitivity to board layout and line transients now make the design eveneasier. The standard 8L PDIP package option reduces cost in lower power, high efficiency applications. The internal lead frame of this package uses six of its pins to transfer heat from the chip directly to the board, eliminating the cost of a heat sink. TOPSwitch incorporates all functions necessary for a switched mode control system into a three terminal monolithic IC: power MOSFET, PWM controller, high voltage start up circuit, loop compensation and fault protection circuitry.
DRAIN Voltage ................................................. -0.3 to 700 V
DRAIN Current Increase ( ID) in 100 ns except during
blanking time ......................................... 0.1 x ILIMIT(MAX)(2)
CONTROL Voltage ..................................... - 0.3 V to 9 V
CONTROL Current ...............................................100 mA
Storage Temperature ..................................... -65 to 125 °C
Operating Junction Temperature(3) ................ -40 to 150 °C
Lead Temperature(4) ................................................ 260 °C
Thermal Impedance: Y Package (JA)(5) .................70 °C/W
(JC)(6) ...................2 °C/W
P/G Package:
(qJA) .........45 °C/W(7); 35 °C/W(8)
(qJC)(6)...............................5 °C/W
Notes:
1. All voltages referenced to SOURCE, TA = 25 °C.
2. Related to transformer saturation see Figure 13.
3. Normally limited by internal circuitry.
4. 1/16" from case for 5 seconds.
5. Free standing with no heatsink.
6. Measured at tab closest to plastic interface or source pin.
7. Soldered to 0.36 sq. inch (232 mm2), 2 oz. (610 gm/m2) copper clad.
8. Soldered to 1 sq. inch (645 mm2), 2 oz. (610 gm/m2) copper clad.