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SST39VF040, SST39VF040-07-4C, SST39VF040-10-4C-WH

Table of contents:
Info of SST39VF040
Info of SST39VF040-07-4C
Info of SST39VF040-10-4C-WH

SST39VF040, SST39VF040-07-4C, SST39VF040-10-4C-WH Selling Leads, Datasheet

MFG:SST Package Cooled:08# D/C:TSOP

SST39VF040, SST39VF040-07-4C, SST39VF040-10-4C-WH Picture

SST39VF040, SST39VF040-07-4C, SST39VF040-10-4C-WH Datasheet download

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Part Number: SST39VF040

MFG: SST

Package Cooled: 08#

D/C: TSOP

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SST39VF040 General Description

The SST39LF512/010/020/040 and SST39VF512/010/ 020/040 are 64K x8, 128K x8, 256K x8 and 5124K x8 CMOS Multi-Purpose Flash (MPF) manufactured with SST's proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39LF512/ 010/020/040 devices write (Program or Erase) with a 3.0- 3.6V power supply. The SST39VF512/010/020/040 devices write with a 2.7-3.6V power supply. The devices conform to JEDEC standard pinouts for x8 memories.

Featuring high performance Byte-Program, the SST39LF512/010/020/040 and SST39VF512/010/020/ 040 devices provide a maximum Byte-Program time of 20 sec. These devices use Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent write, they have on-chip hardware and Software Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications, they are offered with a guaranteed typical endurance of 10,000 cycles. Data retention is rated at greater than 100 years.The SST39LF512/010/020/040 and SST39VF512/010/ 020/040 devices are suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improves performance and reliability, while lowering power consumption. They inherently use less energy during Erase and Program than alternative flash technologies.

The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. These devices also improve flexibility while lowering the cost for program, data, and configuration storage applications. The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles.

To meet surface mount requirements, the SST39LF512/ 010/020/040 and SST39VF512/010/020/040 devices are offered in 32-lead PLCC and 32-lead TSOP packages. TheSST39LF/VF010 and SST39LF/VF020 are also offered in a 48-ball TFBGA package. See Figures 1, 2, 3, and 4 for pin assignments.

SST39VF040 Maximum Ratings

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V_DD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . -2.0V to V_DD+2.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Solder Reflow Temperature1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .260°C for 10 seconds
Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA

1. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions. Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest information.

SST39VF040 Features

• Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
• Single Voltage Read and Write Operations
3.0-3.6V for SST39LF512/010/020/040
2.7-3.6V for SST39VF512/010/020/040
• Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
• Low Power Consumption (typical values at 14 MHz)
Active Current: 5 mA (typical)
Standby Current: 1 A (typical)
• Sector-Erase Capability
Uniform 4 KByte sectors
• Fast Read Access Time:
45 ns for SST39LF512/010/020/040
55 ns for SST39LF020/040
70 and 90 ns for SST39VF512/010/020/040
• Latched Address and Data
• Fast Erase and Byte-Program:
Sector-Erase Time: 18 ms (typical)
Chip-Erase Time: 70 ms (typical)
Byte-Program Time: 14 s (typical)
Chip Rewrite Time:
1 second (typical) for SST39LF/VF512
2 seconds (typical) for SST39LF/VF010
4 seconds (typical) for SST39LF/VF020
8 seconds (typical) for SST39LF/VF040
• Automatic Write Timing
Internal VPP Generation
• End-of-Write Detection
Toggle Bit
Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
Flash EEPROM Pinouts and command sets
• Packages Available
32-lead PLCC
32-lead TSOP (8mm x 14mm)
48-ball TFBGA (6mm x 8mm)
34-ball WFBGA (4mm x 6mm) for 1M and 2M
• All non-Pb (lead-free) devices are RoHS compliant

SST39VF040 Connection Diagram

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