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SST39SF010-90-4C-PHILIPS, SST39SF010A, SST39SF010A-45-4I-NHE

Table of contents:
Info of SST39SF010-90-4C-PHILIPS
Info of SST39SF010A
Info of SST39SF010A-45-4I-NHE

SST39SF010-90-4C-PHILIPS, SST39SF010A, SST39SF010A-45-4I-NHE Selling Leads, Datasheet

MFG:DIP Package Cooled:SST D/C:03+

SST39SF010-90-4C-PHILIPS, SST39SF010A, SST39SF010A-45-4I-NHE Picture

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Part Number: SST39SF010-90-4C-PHILIPS

MFG: DIP

Package Cooled: SST

D/C: 03+

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SST39SF010A General Description

The SST39SF010A/020A/040 are CMOS Multi-Purpose Flash (MPF) manufactured with SST's proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39SF010A/020A/040 devices write (Program or Erase) with a 5.0V power supply. The SST39SF010A/020A/040 devices conform to JEDEC standard pinouts for x8 memories.

Featuring high performance Byte-Program, the SST39SF010A/020A/040 devices provide a maximum Byte-Program time of 20 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent write, they have on-chip hardware and Software Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications, these devices are offered with a guaranteed endurance of 10,000 cycles. Data retention is rated at greater than 100 years.

The SST39SF010A/020A/040 devices are suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption. They inherently use less energy during erase and program than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application.

Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies.These devices also improve flexibility while lowering the cost for program, data, and configuration applications.

The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles.

To meet high density, surface mount requirements, the SST39SF010A/020A/040 are offered in 32-pin PLCC and 32-pin TSOP packages. A 600 mil, 32-pin PDIP is also available. See Figures 1, 2, and 3 for pinouts.

SST39SF010A Maximum Ratings

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V_DD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . -1.0V to V_DD + 1.0V
Voltage on A9 Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 13.2V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 1.0W
Through Hold Lead Soldering Temperature (10 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

SST39SF010A Features

• Organized as 128K x8 / 256K x8 / 512K x8
• Single 5.0V Read and Write Operations
• Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
• Low Power Consumption:
Active Current: 10 mA (typical)
Standby Current: 30 µA (typical)
• Sector-Erase Capability
Uniform 4 KByte sectors
• Fast Read Access Time:
45 and 70 ns
• Latched Address and Data
• Fast Erase and Byte-Program:
Sector-Erase Time: 18 ms (typical)
Chip-Erase Time: 70 ms (typical)
Byte-Program Time: 14 µs (typical)
Chip Rewrite Time:
2 seconds (typical) for SST39SF010A
4 seconds (typical) for SST39SF020A
8 seconds (typical) for SST39SF040
• Automatic Write Timing
Internal VPP Generation
• End-of-Write Detection
Toggle Bit
Data# Polling
• TTL I/O Compatibility
• JEDEC Standard
Flash EEPROM Pinouts and command sets
• Packages Available
32-pin PLCC
32-pin TSOP (8mm x 14mm)
32-pin PDIP

SST39SF010A Connection Diagram

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