PA1901, PA1902A, PA19A Selling Leads, Datasheet
MFG:APEX Package Cooled:QFP-S12P D/C:05+
PA1901, PA1902A, PA19A Datasheet download
Part Number: PA1901
MFG: APEX
Package Cooled: QFP-S12P
D/C: 05+
MFG:APEX Package Cooled:QFP-S12P D/C:05+
PA1901, PA1902A, PA19A Datasheet download
MFG: APEX
Package Cooled: QFP-S12P
D/C: 05+
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PDF/DataSheet Download
Datasheet: PA10
File Size: 62875 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: PA10
File Size: 62875 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: PA19A
File Size: 376832 KB
Manufacturer: APEX
Download : Click here to Download
The PA19 is a high voltage, high current operational amplifier optimized to drive a variety of loads from DC through the video frequency range. Excellent input accuracy is achieved with a dual monolithic FET input transistor which is cascodedby two high voltage transistors to provide outstanding common mode characteristics. All internal current and voltage levels are referenced to a zener diode biased on by a current source. As a result, the PA19 exhibits superior DC and AC stability over a wide supply and temperature range.
High speed and freedom from second breakdown is assured by a complementary power MOS output stage. For optimum linearity, especially at low levels, the power MOS transistors are biased in a class A/B mode. Thermal shutoff provides full protection against overheating and limits the heatsink requirements to dissipate the internal power losses under normal operating conditions. A built-in current limit of 0.5A can be increased with the addition of two external
resistors. Transient inductive load kickback protection is provided by two internal clamping diodes. External phase compensation allows the user maximum flexibility in obtaining the optimum slew rate and gain bandwidth product at all gain settings. A heatsink of proper rating is recommended.
This hybrid circuit utilizes thick film (cermet) resistors, ceramic capacitors, and silicon semiconductor chips to maximize reliability, minimize size, and give top performance. Ultrasonically bonded aluminum wires provide reliable interconnections at all operating temperatures. The 8-pin TO-3 package is hermetically sealed and electrically isolated. The use of compressible thermal washers and/or improper mounting torque will void the product warranty. Please see "General Operating Considerations".