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• For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Excellent clamping capability • Low inductance • Fast response time: typically less than 1.0 ps from 0 volts to BV min • Typical IR less than 1A above 10V • High temperature soldering : 250°C/10 seconds at terminals. • Plastic package has Underwriters Laboratory Flammability Classification 94V-O