NTGS3445T1, NTGS3446, NTGS3446T10SCT-ND Selling Leads, Datasheet
MFG:FAIRCHILD Package Cooled:TSOP-6 D/C:07+
NTGS3445T1, NTGS3446, NTGS3446T10SCT-ND Datasheet download
Part Number: NTGS3445T1
MFG: FAIRCHILD
Package Cooled: TSOP-6
D/C: 07+
NTGS3445T1, NTGS3446, NTGS3446T10SCT-ND
- Table of contents:
Info of NTGS3445T1
Info of NTGS3446
Info of NTGS3446T10SCT-ND
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About NTGD1100L
PDF/DataSheet Download
Datasheet: NTGD1100L
File Size: 106496 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
About NTGS3446
PDF/DataSheet Download
Datasheet: NTGS3446
File Size: 106496 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
About NTGD1100L
PDF/DataSheet Download
Datasheet: NTGD1100L
File Size: 106496 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
NTGS3446 Maximum Ratings
|
Rating |
Symbol |
Value |
Unit |
|
Drain−to−Source Voltage |
VDSS |
20 |
V |
|
Gate−to−Source Voltage |
VGS |
±12 |
V |
|
Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp < 10 s) |
R JA P d I D I DM |
244 0.5 2.5 10 |
°C/W W A A |
|
Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp< 10 s) |
R JA P d I D I DM |
128 1.0 3.6 14 |
°C/W W A A |
|
Thermal Resistance Junction−to−Ambient (Note 3) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp < 10 s) |
RJA Pd I D IDM |
62.5 2.0 5.1 20 |
°C/W W A A |
|
Source Current (Body Diode) |
IS |
5.1 |
A |
|
Operating and Storage Temperature Range |
TJ, Tstg |
−55 to 150 |
°C |
|
Maximum Lead Temperature for Soldering Purposes for 10 seconds |
TL |
260 |
°C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), operating to steady state.
3. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), t < 5.0 seconds.
NTGS3446 Features
• Ultra Low R DS(on)
• Higher Efficiency Extending Battery Life
• Logic Level Gate Drive
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• IDSS Specified at Elevated Temperature
• Pb−Free Package is Available
NTGS3446 Typical Application
• Power Management in portable and battery−powered products, i.e. computers, printers, PCMCIA cards, cellular and cordless
• Lithium Ion Battery Applications
• Notebook PC
NTGS3446 Connection Diagram
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