NE662M03-T1, NE662M03-T1-A, NE662M04 Selling Leads, Datasheet
MFG:NEC Package Cooled: ? D/C:09+
NE662M03-T1, NE662M03-T1-A, NE662M04 Datasheet download
Part Number: NE662M03-T1
MFG: NEC
Package Cooled: ?
D/C: 09+
MFG:NEC Package Cooled: ? D/C:09+
NE662M03-T1, NE662M03-T1-A, NE662M04 Datasheet download
MFG: NEC
Package Cooled: ?
D/C: 09+
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PDF/DataSheet Download
Datasheet: NE600
File Size: 223213 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NE600
File Size: 223213 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NE662M04
File Size: 95818 KB
Manufacturer: NEC [NEC]
Download : Click here to Download
The NE662M04 is fabricated using NEC's UHS0 25 GHz fT wafer process. With a typical transition frequency of 25 GHz the NE662M04 is usable in applications from 100 MHz to 10 GHz. The NE662M04 provides excellent low voltage/low current performance.
NEC's new low profile/flat lead style "M04" package is ideal for today's portable wireless applications. The NE662M04 is an ideal choice for LNA and oscillator requirements in all mobile communication systems.
SYMBOLS |
PARAMETERS |
UNITS |
RATINGS |
VCEO |
Collector to Emitter Voltage |
V |
15 |
VCBO |
Collector to Base Voltage |
V |
3.3 |
VEBO |
Emitter to Base Voltage |
V |
1.5 |
IC |
Collector Current |
mA |
35 |
PT |
Total Power Dissipation |
mW |
115 |
Tj |
Junction Temperature |
°C |
150 |
TSTG |
Storage Temperature |
°C |
-65 to +125 |