MP7614SD-883, MP7614TD-883, MP7616 Selling Leads, Datasheet
MFG:MP Package Cooled:SOP D/C:04+
MP7614SD-883, MP7614TD-883, MP7616 Datasheet download
Part Number: MP7614SD-883
MFG: MP
Package Cooled: SOP
D/C: 04+
MFG:MP Package Cooled:SOP D/C:04+
MP7614SD-883, MP7614TD-883, MP7616 Datasheet download
MFG: MP
Package Cooled: SOP
D/C: 04+
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PDF/DataSheet Download
Datasheet: MP7001
File Size: 155175 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7001
File Size: 155175 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7616
File Size: 93224 KB
Manufacturer: EXAR [Exar Corporation]
Download : Click here to Download
The MP7616 is a high density 16-bit CMOS multiplying Digital- to-Analog Converter. Silicon nitride passivation and untrimmed silicon chromium resistors have been combined to provide long term stability and reliability. Using the most significant bit (MSB) segmentation technique, the MP7616 features 13-bit (0.012%) differential and 12-bit (0.01%) integral linearity.
To achieve 13-bit linearity without laser trim, the MP7616 digitally decodes the four MSB's into 15 equal current sources, rather than the standard binary-weighted sources. Each resistor contributes only 1/16 full scale output thus reducing the matching accuracy requirement of the resistor and CMOS switches from 0.0015% to 0.024%.
The decoding technique achieves an eightfold improvement in differential linearity stability over temperature, an eightfold improvement in relative accuracy due to aging effects (long term stability), a fourfold improvement in glitch amplitude, and a tenfold reduction in sensitivity to output amplifier offset voltage.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to +17 V
Digital Input Voltage to GND . . . . . . .. GND 0.5 to VDD +0.5 V
IOUT1, IOUT2 to GND . . . . . . . . . . . . . GND 0.5 to VDD +0.5 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V
VRFB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V
Storage Temperature . . . . . . . . . . . . . . . . . . 65 to +150
Lead Temperature (Soldering, 10 seconds) . . .. . . . . . . +300
Package Power Dissipation Rating to 75
CDIP, PDIP, SOIC . . . . . . . . . . . . . . . . . . . . . . . .. . . . . 1000mW
Derates above 75. . . . . . . . . . . . . . . . . . . . . . . . . . . 13mW/
NOTES:
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies.