MP7524UD, MP7525JS, MP7528 Selling Leads, Datasheet
MFG:MP Package Cooled:www.dayue-hk.com D/C:09+
MP7524UD, MP7525JS, MP7528 Datasheet download
Part Number: MP7524UD
MFG: MP
Package Cooled: www.dayue-hk.com
D/C: 09+
MFG:MP Package Cooled:www.dayue-hk.com D/C:09+
MP7524UD, MP7525JS, MP7528 Datasheet download
MFG: MP
Package Cooled: www.dayue-hk.com
D/C: 09+
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PDF/DataSheet Download
Datasheet: MP7001
File Size: 155175 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7001
File Size: 155175 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7528
File Size: 146334 KB
Manufacturer: EXAR [Exar Corporation]
Download : Click here to Download
The MP7528 is a dual 8-bit digital/analog converter designed using EXAR's proven decoded DAC architecture. It features excellent DAC-to-DAC matching and guaranteed monotonicity.
Separate on-chip latches are provided for each DAC to allow easy microprocessor interface.
Data is transferred into either of the two DAC data latches via a common 8-bit TTL/CMOS compatible input port. Control input DACA/DACB determines which DAC is to be loaded. The MP7528's load cycle is similar to the write cycle of a random access memory and the device is bus compatible with most 8-bit microprocessors.
The device operates from a +5V to +15V power supply with only 2 mA of current (maximum).
Both DACs offer excellent four quadrant multiplication characteristics with a separate reference input and feedback resistor for each DAC.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+17 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 V
(Functionality Guaranteed +0.5 V)
Digital Input Voltage to DGND . . . . . . . . . . . . . . . . 0.5 V, +17 V
VPIN2, VPIN20 to GND . . . . . . . . . . . . . . . . . . . . . .0.5 V, +17 V
VREFA, VREFB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25
VRFBA, VRFBB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±25 V
Storage Temperature . . . . . . . . . . . . . . . . 65°C to +150°C
Lead Temperature (Soldering, 10 secs.) . . . . . . . . . . . . .+300°C
Package Power Dissipation Rating to 75°C
CDIP, PDIP, SOIC, PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . 900mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . . . . . . .12mW/°C
NOTES:
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies.
3 GND refers to AGND and DGND.