LX1665, LX1665ADM, LX1665CDW-TANDR Selling Leads, Datasheet
MFG:LINF Package Cooled:SOP20 D/C:07/08+
LX1665, LX1665ADM, LX1665CDW-TANDR Datasheet download
Part Number: LX1665
MFG: LINF
Package Cooled: SOP20
D/C: 07/08+
MFG:LINF Package Cooled:SOP20 D/C:07/08+
LX1665, LX1665ADM, LX1665CDW-TANDR Datasheet download
MFG: LINF
Package Cooled: SOP20
D/C: 07/08+
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PDF/DataSheet Download
Datasheet: LX1665
File Size: 362992 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: LX1004
File Size: 155181 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: LX1004
File Size: 155181 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
Supply Voltage (VC1) .................................................................................................... 25V
Supply Voltage (VCC) .................................................................................................... 15V
Output Drive Peak Current Source (500ns)............................................................... 1.5A
Output Drive Peak Current Sink (500ns) ................................................................... 1.5A
Input Voltage (SS, INV, VCC_CORE, CT, VID0-VID4) ........................................... -0.3V to 6V
Operating Junction Temperature
Plastic (N, D & DW Packages) ............................................................................. 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.