KRC659E-RTK/P, KRC660U, KRC661U Selling Leads, Datasheet
MFG:KEC Package Cooled:SOT-553 D/C:05+NOPB7400
KRC659E-RTK/P, KRC660U, KRC661U Datasheet download
Part Number: KRC659E-RTK/P
MFG: KEC
Package Cooled: SOT-553
D/C: 05+NOPB7400
KRC659E-RTK/P, KRC660U, KRC661U
- Table of contents:
Info of KRC659E-RTK/P
Info of KRC660U
Info of KRC661U
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About KRC101
PDF/DataSheet Download
Datasheet: KRC101
File Size: 681745 KB
Manufacturer: KEC [KEC(Korea Electronics)]
Download : Click here to Download
About KRC660U
PDF/DataSheet Download
Datasheet: KRC660U
File Size: 51829 KB
Manufacturer: KEC [KEC(Korea Electronics)]
Download : Click here to Download
About KRC661U
PDF/DataSheet Download
Datasheet: KRC661U
File Size: 51829 KB
Manufacturer: KEC [KEC(Korea Electronics)]
Download : Click here to Download
KRC660U Maximum Ratings
|
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT |
| Collector-Base Voltage |
VCBO |
50 |
V |
| Collector-Emitter Voltage |
VCEO |
50 |
V |
| Emitter-Base Voltage |
VEBO |
5 |
V |
| Collector Current |
IC |
100 |
mA |
| Collector Power Dissipation |
PC * |
200 |
mW |
| Junction Temperature |
Tj |
150 |
|
| Storage Temperature Range |
Tstg |
-55~150 |
* Total Rating.
KRC660U Features
·With Built-in Bias Resistors.
·Simplify Circuit Design.
·Reduce a Quantity of Parts and Manufacturing Process.
·High Packing Density.
·Simplify Circuit Design.
·Reduce a Quantity of Parts and Manufacturing Process.
·High Packing Density.
KRC661U Maximum Ratings
|
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT |
| Collector-Base Voltage |
VCBO |
50 |
V |
| Collector-Emitter Voltage |
VCEO |
50 |
V |
| Emitter-Base Voltage |
VEBO |
5 |
V |
| Collector Current |
IC |
100 |
mA |
| Collector Power Dissipation |
PC * |
200 |
mW |
| Junction Temperature |
Tj |
150 |
|
| Storage Temperature Range |
Tstg |
-55~150 |
* Total Rating.
KRC661U Features
·With Built-in Bias Resistors.
·Simplify Circuit Design.
·Reduce a Quantity of Parts and Manufacturing Process.
·High Packing Density.
·Simplify Circuit Design.
·Reduce a Quantity of Parts and Manufacturing Process.
·High Packing Density.
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