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The 9 Meg 'NLF/NVF' product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, 'no wait' state, device for networking and communications applications. They are organized as 256K words by 36 bits and 512K words by 18 bits, fabricated with ISSI's advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles are eliminated when the bus switches from read to write, or write to read. This device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit.
All synchronous inputs pass through registers are controlled by a positive-edge-triggered single clock input. Operations may be suspended and all synchronous inputs ignored when Clock Enable, CKE is HIGH. In this state the internal device will hold their previous values.
All Read, Write and Deselect cycles are initiated by the ADV input. When the ADV is HIGH the internal burst counter is incremented. New external addresses can be loaded when ADV is LOW.
Write cycles are internally self-timed and are initiated by the rising edge of the clock inputs and when WE is LOW. Separate byte enables allow individual bytes to be written. A burst mode pin (MODE) defines the order of the burst sequence. When tied HIGH, the interleaved burst sequence is selected. When tied LOW, the linear burst sequence is selected.
IS61NLF51218A Maximum Ratings
Symbol
Parameter
Value
Unit
TSTG
Storage Temperature
65 to +150
°C
PD
Power Dissipation
1.6
W
IOUT
Output Current (per I/O)
100
mA
VIN, VOUT
Voltage Relative to VSS for I/O Pins
0.5 to VDDQ + 0.3
V
VIN
Voltage Relative to VSS for for Address and Control Inputs
0.3 to 4.6
V
Notes: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
IS61NLF51218A Features
• 100 percent bus utilization • No wait cycles between Read and Write • Internal self-timed write cycle • Individual Byte Write Control • Single Read/Write control pin • Clock controlled, registered address, data and control • Interleaved or linear burst sequence control using MODE input • Three chip enables for simple depth expansion and address pipelining • Power Down mode • Common data inputs and data outputs • CKE pin to enable clock and suspend operation • JEDEC 100-pin TQFP, 119-ball PBGA, and 165- ball PBGA packages • Power supply: NVF: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%) NLF: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%) • JTAG Boundary Scan for PBGA packages • Industrial temperature available • Lead-free available
IS61NLF51218A Connection Diagram
IS61NLF51218A-7.5TQI Parameters
Technical/Catalog Information
IS61NLF51218A-7.5TQI
Vendor
ISSI, Integrated Silicon Solution Inc
Category
Integrated Circuits (ICs)
Memory Type
SRAM - Synchronous
Memory Size
9M (512K x 18)
Speed
117MHz
Interface
Parallel
Package / Case
100-TQFP
Packaging
Tray
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Format - Memory
RAM
Lead Free Status
Contains Lead
RoHS Status
RoHS Non-Compliant
Other Names
IS61NLF51218A 7 5TQI IS61NLF51218A75TQI
IS61NLF51236 General Description
The 18 Meg 'NLF/NVF' product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, 'no wait' state, device for networking and communications applications. They are organized as 256K words by 72 bits, 512K words by 36 bits and 1M words by 18 bits, fabricated with ISSI's advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles are eliminated when the bus switches from read to write, or write to read. This device integrates a 2-bit burst counter, high-speed SRAM core, and high-drive capability outputs into a single monolithic circuit.
All synchronous inputs pass through registers are controlled by a positive-edge-triggered single clock input. Operations may be suspended and all synchronous inputs ignored when Clock Enable, CKE is HIGH. In this state the internal device will hold their previous values.
All Read, Write and Deselect cycles are initiated by the ADV input. When the ADV is HIGH the internal burst counter is incremented. New external addresses can be loaded when ADV is LOW.
Write cycles are internally self-timed and are initiated by the rising edge of the clock inputs and when WE is LOW. Separate byte enables allow individual bytes to be written. A burst mode pin (MODE) defines the order of the burst sequence. When tied HIGH, the interleaved burst sequence is selected. When tied LOW, the linear burst sequence is selected.
IS61NLF51236 Maximum Ratings
Symbol
Parameter
Value
Unit
TSTG
Storage Temperature
65 to +150
°C
PD
Power Dissipation
1.6
W
IOUT
Output Current (per I/O)
100
mA
VIN, VOUT
Voltage Relative to VSS for I/O Pins
0.5 to VDDQ + 0.3
V
VIN
Voltage Relative to VSS for for Address and Control Inputs
0.3 to 4.6
V
IS61NLF51236 Features
• 100 percent bus utilization • No wait cycles between Read and Write • Internal self-timed write cycle • Individual Byte Write Control • Single Read/Write control pin • Clock controlled, registered address, data and control • Interleaved or linear burst sequence control using MODE input • Three chip enables for simple depth expansion and address pipelining • Power Down mode • Common data inputs and data outputs • CKE pin to enable clock and suspend operation • JEDEC 100-pin TQFP, 165-ball PBGA and 209- ball (x72) PBGA packages • Power supply: NVF: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%) NLF: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%) • JTAG Boundary Scan for PBGA packages • Industrial temperature available • Lead-free available