Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
The IRF6635PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6635PbF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced losses make this product ideal for high frequency/high efficiency DC-DC converters that power high current loads such as the latest generation of microprocessors. The IRF6635PbF has been optimized for parameters that are critical in synchronous buck converter!'s SyncFET sockets
IRF6635TRPBF Maximum Ratings
Parameter
Max.
Units
VDS
Drain-to-Source Voltage
30
V
VGS
Gate-to-Source Voltage
±20
ID @ TA = 25
Continuous Drain Current, VGS @ 10V
32
A
ID @ TA = 70
Continuous Drain Current, VGS @ 10V
25
ID @ TC = 25
Continuous Drain Current, VGS @ 10V
180
IDM
Pulsed Drain Current
250
EAS
Single Pulse Avalanche Energy
200
mJ
IAR
Avalanche Current
25
A
IRF6635TRPBF Features
`RoHs Compliant ` Lead-Free (Qualified up to 260Reflow `Application Specific MOSFETs `Ideal for CPU Core DC-DC Converters `Low Conduction Losses `High Cdv/dt Immunity Low Profile (<0.7mm) `Dual Sided Cooling Compatible `Compatible with existing Surface Mount Techniques