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This chip LED Is designed in an industry standard package for ease of handling and use.
The HSMG-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. This packageis compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.
HSMG-C150 Maximum Ratings
By employing a feedback system and the ADJD-J823, the light output produced by the LED array maintains its color over time and temperature. In addition, using a serial interface, specifying the color of the LED array's light output is as simple as picking the target color coordinates from the CIE color space and writing several bytes of data to the device.
This chip LED is designed in an industry standard package for ease of handling and use.
The HSMG-C170 has the widely used 2.0 x 1.25 mm footprint.
This package is compatible with IR reflow solder processes. The small size and wide viewing angle makes this LED prime choices for backlighting applications and front panel illumination especially where space is a premium.