HFM305, HFM305-T, HFM305-W Selling Leads, Datasheet
MFG:RECRON Package Cooled:DO214AB D/C:09+
HFM305, HFM305-T, HFM305-W Datasheet download
Part Number: HFM305
MFG: RECRON
Package Cooled: DO214AB
D/C: 09+
HFM305, HFM305-T, HFM305-W
- Table of contents:
Info of HFM305
Info of HFM305-T
Info of HFM305-W
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About HFM305
PDF/DataSheet Download
Datasheet: HFM305
File Size: 72408 KB
Manufacturer: RECTRON [Rectron Semiconductor]
Download : Click here to Download
About HFM101
PDF/DataSheet Download
Datasheet: HFM101
File Size: 71414 KB
Manufacturer: FORMOSA [Formosa MS]
Download : Click here to Download
About HFM101
PDF/DataSheet Download
Datasheet: HFM101
File Size: 71414 KB
Manufacturer: FORMOSA [Formosa MS]
Download : Click here to Download
HFM305 Maximum Ratings
| PARAMETER | CONDITIONS | Symbol | MIN. | TYP. | MAX. | UNIT |
| Forward rectified current | Ambient temperature = 50 | IO | 3.0 | A | ||
| Forward surge current | 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) |
IFSM | 100 | A | ||
| Reverse current | VR = VRRM TA = 25 | IR | 10.0 | uA | ||
| VR = VRRM TA = 100oC | 300 | uA | ||||
| Thermal resistance | Junction to ambient | RJA | 15 | / w | ||
| Diode junction capacitance | f=1MHz and applied 4vDC reverse voltage | CJ | 70 | pF | ||
| Storage temperature | TSTG | -55 | +150 |
HFM305 Features
·Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
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