HD74ALS74P, HD74ALV2G04USE, HD74ALVC162334 Selling Leads, Datasheet
MFG:HIT Package Cooled:DIP D/C:06+
HD74ALS74P, HD74ALV2G04USE, HD74ALVC162334 Datasheet download
Part Number: HD74ALS74P
MFG: HIT
Package Cooled: DIP
D/C: 06+
MFG:HIT Package Cooled:DIP D/C:06+
HD74ALS74P, HD74ALV2G04USE, HD74ALVC162334 Datasheet download
MFG: HIT
Package Cooled: DIP
D/C: 06+
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PDF/DataSheet Download
Datasheet: HD71830
File Size: 1260348 KB
Manufacturer: Hitachi
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HD71830
File Size: 1260348 KB
Manufacturer: Hitachi
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HD74ALVC162334
File Size: 53488 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
This HD74ALVC162334 is a 16-bit universal bus driver is designed for 2.3 V to 3.6 V VCC operation.
Data flow from A to Y is controlled by the output enable (OE) input. The device operates in the transparent mode when the latch enable (LE) input is low. When LE is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is high, the A data is stored in the latch/flip flop on the low to high transition of CLK. When OE is high, the outputs are in the high impedance state.
To ensure the high impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current sinking capability of the driver.
All outputs, which are designed to sink up to 12 mA, include equivalent 26 resistors to reduce overshoot and undreshoot.
Item |
Symbol |
Ratings |
Unit |
Conditions |
Supply voltage |
VCC |
0.5 to 4.6 |
V |
|
Input voltage *1 |
VI |
0.5 to 4.6 |
V |
|
Output voltage *1, 2 |
VO |
0.5 to VCC +0.5 |
V |
Output : H or L |
Input clamp current |
IIK |
-50 |
mA |
VI<0 |
Output clamp current |
IOK |
±50 |
mA |
VO<0 or VO >VCC |
Continuous output current |
IO |
±50 |
mA |
VO = 0 to VCC |
VCC, GND current / pin |
ICC or IGND |
±100 |
mA |
|
Maximum power dissipation at Ta = 55°C (in still air)*3 |
PT |
0.85 |
mW |
TSSOP |
Storage temperature |
Tstg |
65 to 150 |
°C |
Notes: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C
and a board trace length of 750 mils.