HC1620A, HC163, HC163A Selling Leads, Datasheet
MFG:HENWOOD Package Cooled:QFP D/C:2000
HC1620A, HC163, HC163A Datasheet download
Part Number: HC1620A
MFG: HENWOOD
Package Cooled: QFP
D/C: 2000
MFG:HENWOOD Package Cooled:QFP D/C:2000
HC1620A, HC163, HC163A Datasheet download
MFG: HENWOOD
Package Cooled: QFP
D/C: 2000
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PDF/DataSheet Download
Datasheet: HC109
File Size: 49047 KB
Manufacturer: SLS [System Logic Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HC163
File Size: 88159 KB
Manufacturer: SLS [System Logic Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HC109
File Size: 49047 KB
Manufacturer: SLS [System Logic Semiconductor]
Download : Click here to Download
Symbol | Parameter | Value | Unit |
vcc | DC Supply Voltage (Referenced to GND) | 0.5 to +7.0 | V |
VIN | DC Input Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
VOUT | DC Output Voltage (Referenced to GND) | 0.5 to VCC + 0.5 | V |
LIN | DC Input Current, per Pin | ±20 | mA |
IOUT | DC Onput Current, per Pin | ±25 | mA |
ICC | DC Supply Current Per Supply Pin | ±50 | mA |
PD | Power dissipation in still air piastic DIP SOIC package |
750 500 |
mW |
TSTG | Storage Temperature | 65 to +150 | °C |
TL | Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) |
260 | °C |