FM3164-GTR, FM3164-S, FM31L278-G Selling Leads, Datasheet
MFG:RAMTRON Package Cooled:SOP14 D/C:08+
FM3164-GTR, FM3164-S, FM31L278-G Datasheet download
Part Number: FM3164-GTR
MFG: RAMTRON
Package Cooled: SOP14
D/C: 08+
MFG:RAMTRON Package Cooled:SOP14 D/C:08+
FM3164-GTR, FM3164-S, FM31L278-G Datasheet download
MFG: RAMTRON
Package Cooled: SOP14
D/C: 08+
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PDF/DataSheet Download
Datasheet: FM301
File Size: 69702 KB
Manufacturer: RECTRON [Rectron Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: FM301
File Size: 69702 KB
Manufacturer: RECTRON [Rectron Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: FM301
File Size: 69702 KB
Manufacturer: RECTRON [Rectron Semiconductor]
Download : Click here to Download
The FM31L278-G is a kind of integrated processor. It includes the most commonly needed functions for processor-based systems. RAM size includes 256 Kb. It operates from 2.7 to 3.6 V.
There is some information about the features. (1) high integration device replaces multiple parts: serial nonvolatile memory, real-time clock (RTC), low voltage reset, watchdog timer, early power-fail warning/NMI, two 16-bit event counters and serial number with write-lock for security; (2) ferroelectric nonvolatile RAM; real-time clock/calendar: backup current under 1 A and software calibration; processor companion: active-low reset output for VDD and watchdog, programmable VDD reset trip point, programmable watchdog timer and 64-bit programmable serial number with lock; fast two-wire serial interface: up to 1 MHz maximum bus frequency, device select pins for up to 4 memory devices and RTC, supervisor controlled via 2-wire interface.
The following is about the absolute maximum ratings. (1): VDD (power supply voltage with respect to VSS) is from -1.0 to +5.0 V; (2): VIN (voltage on any signal pin with respect to VSS) is from -1.0 to +5.0 V and VIN VDD+1.0 V; (3): VBAK (backup supply voltage) is from -1.0 to +4.5 V; (4): TSTG (storage temperature) is from -55 to +125; (5): TLEAD (lead temperature (soldering, 10 seconds)) is 300; (6): VESD (electrostatic discharge voltage) is 3 kV for human body model and 1 kV for charged device model.