DS75365, DS75365J, DS75365M Selling Leads, Datasheet
MFG:NS Package Cooled:200 D/C:N/A
DS75365, DS75365J, DS75365M Datasheet download
Part Number: DS75365
MFG: NS
Package Cooled: 200
D/C: N/A
DS75365, DS75365J, DS75365M
- Table of contents:
Info of DS75365
Info of DS75365J
Info of DS75365M
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About DS75365
PDF/DataSheet Download
Datasheet: DS75365
File Size: 191332 KB
Manufacturer: NSC [National Semiconductor]
Download : Click here to Download
About DS7
PDF/DataSheet Download
Datasheet: DS7
File Size: 68288 KB
Manufacturer: Linear
Download : Click here to Download
About DS7
PDF/DataSheet Download
Datasheet: DS7
File Size: 68288 KB
Manufacturer: Linear
Download : Click here to Download
DS75365 General Description
The DS75365 is a quad monolithic integrated TTL-to-MOS driver and interface circuit that accepts standard TTL input signals and provides high-current and high-voltage output evels suitable for driving MOS circuits. It is used to drive address, control, and timing inputs for several types of MOS RAMs including the 1103.
The DS75365 operates from the TTL 5V supply and the MOS VSS and VBB supplies in many applications. This device has been optimized for operation with VCC2 supply voltage from 16V to 20V, and with nominal VCC3 supply voltage from 3V to 4V higher than VCC2. However, it is designed so as to be usable over a much wider range of VCC2 and VCC3. In some applications the VCC3 power supply can be eliminated by connecting the VCC3 to the VCC2 pin.
DS75365 Maximum Ratings
±Supply Voltage Range of VCC1 ±0.5V to 7V
Supply Voltage Range of VCC2 ±0.5V to 25V
Supply Voltage Range of VCC3 0.5V to 30V
nput Voltage 5.5V
Inter-Input Voltage (Note 4) 5.5V
Storage Temperature Range ±65§C to a150
Maximum Power Dissipation* at 25
Cavity Package 1509 mW
Molded Package 1476 mW
SO Package 1488 mW
Lead Temperature (Soldering, 10 sec) 300
Supply Voltage Range of VCC2 ±0.5V to 25V
Supply Voltage Range of VCC3 0.5V to 30V
nput Voltage 5.5V
Inter-Input Voltage (Note 4) 5.5V
Storage Temperature Range ±65§C to a150
Maximum Power Dissipation* at 25
Cavity Package 1509 mW
Molded Package 1476 mW
SO Package 1488 mW
Lead Temperature (Soldering, 10 sec) 300
DS75365 Features
* Quad positive-logic NAND TTL-to-MOS driver
* Versatile interface circuit for use between TTL and high-current, high-voltage systems
* Capable of driving high-capacitance loads
* Compatible with many popular MOS RAMs
* Interchangeable with Intel 3207
* VCC2 supply voltage variable over side range to 24V maximum
* VCC3 supply voltage pin available
* VCC3 pin can be connected to VCC2 pin in some applications
* TTL compatible diode-clamped inputs
* Operates from standard bipolar and MOS supply voltages
*Two common enable inputs per gate-pair
* High-speed switching
* Transient overdrive minimizes power dissipation
* Low standby power dissipation
* Versatile interface circuit for use between TTL and high-current, high-voltage systems
* Capable of driving high-capacitance loads
* Compatible with many popular MOS RAMs
* Interchangeable with Intel 3207
* VCC2 supply voltage variable over side range to 24V maximum
* VCC3 supply voltage pin available
* VCC3 pin can be connected to VCC2 pin in some applications
* TTL compatible diode-clamped inputs
* Operates from standard bipolar and MOS supply voltages
*Two common enable inputs per gate-pair
* High-speed switching
* Transient overdrive minimizes power dissipation
* Low standby power dissipation
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