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Reference to GND V+ . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6 V IN, COM, NC, NOa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V+ + 0.3 V) Continuous Current (Any terminal) . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Peak Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA (Pulsed at 1 ms, 10% duty cycle) Storage Temperature (D Suffix) . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C Power Dissipation (Packages)b TSSOP-16c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW QFN-16 (4 x 4 mm)d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1880 mW Notes: a. Signals on NC, NO, or COM or IN exceeding V+ will be clamped by internal diodes. Limit forward diode current to maximum current ratings. b. All leads welded or soldered to PC Board. c. Derate 5.6 mW/ above 70 d. Derate 23.5 mW/ above 70 e. Manual soldering with soldering iron is not recommended for leadless components. The QFN is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper lip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
DG2042 Features
Low Voltage Operation (1.8 V to 5.5 V) Low On-Resistance - r DS(on): 1.0 Fast Switching - 14 ns tON Low Charge Injection - Q INJ: 1 pC Low Power Consumption TTL/CMOS Compatible TSSOP-16 and QFN-16 Packages
DG2042 Typical Application
Cellular Phones Communication Systems Portable Test Equipment Battery Operated Systems Sample and Hold Circuits