BZT52C3V0, BZT52C3V0/W2, BZT52C3V0S Selling Leads, Datasheet
MFG:HKT,CJ,GSM Package Cooled:SOD-123/323 D/C:N/A
BZT52C3V0, BZT52C3V0/W2, BZT52C3V0S Datasheet download
Part Number: BZT52C3V0
MFG: HKT,CJ,GSM
Package Cooled: SOD-123/323
D/C: N/A
BZT52C3V0, BZT52C3V0/W2, BZT52C3V0S
- Table of contents:
Info of BZT52C3V0
Info of BZT52C3V0/W2
Info of BZT52C3V0S
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About BZT52C3V0
PDF/DataSheet Download
Datasheet: BZT52C3V0
File Size: 78157 KB
Manufacturer: DIOTEC [Diotec Semiconductor]
Download : Click here to Download
About BZT03
PDF/DataSheet Download
Datasheet: BZT03
File Size: 47259 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
About BZT52C3V0S
PDF/DataSheet Download
Datasheet: BZT52C3V0S
File Size: 73477 KB
Manufacturer: FORMOSA [Formosa MS]
Download : Click here to Download
BZT52C3V0 Maximum Ratings
|
Characteristic |
Symbol |
Value |
Unit |
| Forward Voltage (Note 2) @ IF = 10mA |
VF |
0.9 |
V |
| Power Dissipation (Note 1) |
Pd |
500 |
mW |
| Thermal Resistance, Junction to Ambient Air (Note 1) |
RJA |
305 |
/W |
| Operating and Storage Temperature Range |
Tj, TSTG |
-65 to +150 |
|
2. Short duration test pulse used to minimize self-heating effect.
BZT52C3V0 Features
· Planar Die Construction
· 500mW Power Dissipation on Ceramic PCB
· General Purpose, Medium Current
· Ideally Suited for Automated Assembly Processes
· Available in Lead Free Version
· 500mW Power Dissipation on Ceramic PCB
· General Purpose, Medium Current
· Ideally Suited for Automated Assembly Processes
· Available in Lead Free Version
BZT52C3V0 Connection Diagram
BZT52C3V0S Maximum Ratings
| Part Number | BZT52C3V0S |
| Power Rating (mW) | 200 |
| NomVZ | 3 |
| @ IZT (mA) | 5 |
| Tol V (typ) (%) | 6.67 |
| IR (µA) | 10 |
BZT52C3V0S Connection Diagram
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