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The Bridges series from ST Microelectronics has been designed to allow a better standardization of packages on boards principally designedwith ISO- TOP packages. The insulated package of the bridge will be able to sit on heatsink with other components. Single phase and 3-phase high power SMPS, UPS, MOTOR DRIVES andWELD- ING equipment will primarily find advantage in these industry package products.
BF3510TV Maximum Ratings
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
1000
V
VRSM
Non repetitive peak reverse voltage
1000
V
IF(AV) total
Average forward current
Tc=80 Sinus
35
A
IFSM
Surge non repetitive forward current 50Hz JEDEC method
300
A
I2.t
Fusing
660
A2.s
Tstg
Storage temperature range
- 65 to + 150
Tj
Maximumoperating junction temperature
150
Pmax total
Total power dissipation
50
W
BF3510TV Features
COMPACT ISOTOP DESIGN COMPATIBLE WITH FAST DIODES ANDTRANSISTORS. EXCELLENTTHERMAL TRANSFER BETWEEN JUNCTION AND HEATSINK UL PENDING