AWT6301R, AWT6302, AWT6430R Selling Leads, Datasheet
MFG:ANADIGIC Package Cooled:QFN BULK D/C:05+
AWT6301R, AWT6302, AWT6430R Datasheet download
Part Number: AWT6301R
MFG: ANADIGIC
Package Cooled: QFN BULK
D/C: 05+
MFG:ANADIGIC Package Cooled:QFN BULK D/C:05+
AWT6301R, AWT6302, AWT6430R Datasheet download
MFG: ANADIGIC
Package Cooled: QFN BULK
D/C: 05+
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PDF/DataSheet Download
Datasheet: AWT0901S3C
File Size: 116449 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: AWT6302
File Size: 153001 KB
Manufacturer: ANADIGICS [ANADIGICS, Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: AWT0901S3C
File Size: 116449 KB
Manufacturer:
Download : Click here to Download
The AWT6302 meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets. The package pinout was chosen to enable handset manufacturers to switch from a 4 x 4 mm PA module with very few layout changes to the phone board. The PA module is optimized for Vref = +2.85 V. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 3 x 3 x 1.1 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 system.
Frequency (MHz) | 1850 - 1910 |
Peak CDMA Output Power (dBm) | 28 |
Power Added Efficiency (%) | 39% @ +28 dBm |
Icq (mA) | 50 |
Package (mm) | 3 x 3 x 1.1 |