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Part Number: 5962-8767906KPC

 

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About 5962-0051001QXA

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Datasheet: 5962-0051001QXA

File Size: 1254149 KB

Manufacturer: TI [Texas Instruments]

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About 5962-0051001QXA

PDF/DataSheet Download

Datasheet: 5962-0051001QXA

File Size: 1254149 KB

Manufacturer: TI [Texas Instruments]

Download : Click here to Download

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About 5962-0051001QXA

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Datasheet: 5962-0051001QXA

File Size: 1254149 KB

Manufacturer: TI [Texas Instruments]

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5962-8767906KPC General Description

The DSCC SMD 5962-8767906KPC is a Class K two channel hermetically sealed optocoupler in an 8-Pin ceramic DIP package with gold plated leads and the highest level of reliability. Solder dipped leads and various lead form options are also available. See datasheet for details.
The product is capable of operation and storage over the full mil temp range and may also be purchased as either commercial grade or with MIL-PRF-38534 Class H testing on the same SMD. The 5962-8767906KPC is manufactured and tested on a MIL-PRF-38534 certified line and included in the DSCC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
The device contains a GaAsP LED which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors improve the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base-collector capacitance.
The device is suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% min at IF = 16mA. The 18V Vcc capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers.
This product is also available with the transistor base node connected to improve common mode immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.
Package styles for this die set in one, two or four channels are 8 and 16-Pin DIP thru hole, 16-Pin surface mount DIP flat pack, and 20 pad leadless ceramic chip carrier. Most devices are available with a variety of lead forms and plating options. See datasheet for details.
As the same die are used for each channel of each device listed in the datasheet, abs max ratings, recommended operating conditions, elec specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.

5962-8767906KXA General Description

The DSCC Class K Standard Microcircuit Drawing (SMD) 5962-8767906KXA device is a Highest Reliability Space Grade HCPL-553K with surface mountable gull wing lead form and solder dipped lead finish. The solder contains lead. Please use the Datasheet link for further details.

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