MFG:Aavid Thermalloy Category:Fans, Thermal Management D/C:09+
529701B02500G, 529702B02500G, 52973-0490 Datasheet download
Category: Fans, Thermal Management
MFG: Aavid Thermalloy
Package Cooled:
D/C: 09+
Description: BOARD LEVEL HEATSINK 1" TO-220
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Datasheet:
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PDF/DataSheet Download
Datasheet:
File Size: KB
Manufacturer:
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| Technical/Catalog Information | 529701B02500G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Bolt On and PC Pin |
| Height | 1" (25.4mm) |
| Material | Aluminum |
| Package Cooled | TO-218 |
| Power Dissipation @ Temperature Rise | 12W @ 70°C |
| Thermal Resistance @ Forced Air Flow | 4.0°C/W @ 200 LFM |
| Outline | 41.91mm x 25.40mm |
| Thermal Resistance @ Natural | 5.5°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 529701B02500G 529701B02500G |
| Thermal Resistance | 5.50 |
| Part # | Description | Finish | Board Mounting |
| 529701B02500G | Extruded heat sink with large radial fins and solderable pins | Black Anodize | View Hole Dimensions |
| This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. | |||
| Technical/Catalog Information | 529702B02500G |
| Vendor | Aavid Thermalloy |
| Category | Fans, Thermal Management |
| Attachment Method | Bolt On and PC Pin |
| Height | 1" (25.4mm) |
| Material | Aluminum |
| Package Cooled | TO-220 |
| Power Dissipation @ Temperature Rise | 4W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 4.0°C/W @ 200 LFM |
| Outline | 41.91mm x 25.40mm |
| Thermal Resistance @ Natural | 5.5°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 529702B02500G 529702B02500G HS404 ND HS404ND HS404 |
| Thermal Resistance | 5.50 |
| Part # | Description | Finish | Board Mounting |
| 529702B02500G | Extruded heat sink with large radial fins and solderable pins | Black Anodize | View Hole Dimensions |
| This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. | |||
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