v300B12C300A

Features: •DC input range: 250- 425V•Input surge withstand: 500Vfor 100ms•DC output: 24V•Programmable output: 10 to 110%•Regulation: ±0.3% •Efficiency: 87%•Maximum operating temperature: 100°C at full load•Power density: 120W/cubic inch•Height ...

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SeekIC No. : 004539734 Detail

v300B12C300A: Features: •DC input range: 250- 425V•Input surge withstand: 500Vfor 100ms•DC output: 24V•Programmable output: 10 to 110%•Regulation: ±0.3% •Efficiency: 87%•...

floor Price/Ceiling Price

Part Number:
v300B12C300A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

•DC input range: 250- 425V
•Input surge withstand: 500Vfor 100ms
•DC output: 24V
•Programmable output: 10 to 110%
•Regulation: ±0.3%
•Efficiency: 87%
•Maximum operating temperature:   100°C at full load
•Power density: 120W/cubic inch
•Height above board: 0.43 in. (10,9 mm)
•Parallelable, with N+M fault tolerance
•Low noise ZCS/ZVS architecture



Application

distributed power;off-line systems using power PFC front-ends;electric vehicles


Specifications

Parameter Rating Unit Notes
+In to In voltage -0.5 to +425. 0Vdc  
+In to In voltage 500 Vdc<100 ms
PC to In voltage -0.5 to +7.0 Vdc  
PR to In voltage -0.5 to +7.0 Vdc  
+Out to Out voltage -0.5 to +31.7 Vdc  
+Sense to Out voltage -0.5 to +31.7 Vdc  
Sense to Out voltage 1.0 Vdc  
SC to Out voltage -0.5 to +1.5 Vdc  
Isolation voltage (in to out) 3000 Vrms  
Isolation voltage (in to base) 1550 Vrms  
Isolation voltage (out to base) 500 Vrms  
Storage temperature (CGrade) -40 to +125 °C See part numbering chart on this
page for other product grades.
Operating temperature(CGrade) -20 to +100 °C Baseplate
Pin soldering temperature 500 (260) °F(°C) <5 sec;wave solder
Pin soldering temperature 750 (390) °F (°C) <7 sec;hand solder
Mounting torque 5 (0.57) in-lbs (N-m) 6 each, # 4-40 or M3



Description

The v300B12C300A uses 2nd Generation power processing, controland packaging technologies to provide the performance, flexibility and cost effectiveness expected of a mature power component. For example, a plated-cavity core transformer couples widely separated primary andsecondary  windings, resulting in low in-to-out parasitic capacitance and noise. High frequency ZCS/ZVS switching,advanced power semiconductor packagingand thermal management provide highpower density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count of a 1st Generation converter.  




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