uPC3230GR

Features: ·f(in):30~100MHz AGC AMPLIFIERBLOCK·ICC :37mA @5.0V·Gmax:30dB·GCR:40dB·IM3:45dBc(min)/53dB(typ)@Output=0.5Vp-p/tone PRE AMPLIFIER BLOCK·ICC :61mA @5.0V·Gain :28dB(typ)·NF :6.6dB(typ)·IM3:58dB(typ)@Output=2.5Vp-p/tone Package·High-density surface mounting : 16-pin SSOP package 5.2×4.4×1.5...

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uPC3230GR Picture
SeekIC No. : 004538032 Detail

uPC3230GR: Features: ·f(in):30~100MHz AGC AMPLIFIERBLOCK·ICC :37mA @5.0V·Gmax:30dB·GCR:40dB·IM3:45dBc(min)/53dB(typ)@Output=0.5Vp-p/tone PRE AMPLIFIER BLOCK·ICC :61mA @5.0V·Gain :28dB(typ)·NF :6.6dB(typ)·IM3:5...

floor Price/Ceiling Price

Part Number:
uPC3230GR
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/1/4

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Product Details

Description



Features:

·f(in):30~100MHz AGC AMPLIFIERBLOCK
·ICC :37mA @5.0V
·Gmax:30dB
·GCR:40dB
·IM3:45dBc(min)/53dB(typ)@Output=0.5Vp-p/tone PRE AMPLIFIER BLOCK
·ICC :61mA @5.0V
·Gain :28dB(typ)
·NF :6.6dB(typ)
·IM3:58dB(typ)@Output=2.5Vp-p/tone Package
·High-density surface mounting : 16-pin SSOP package 5.2×4.4×1.5mm



Application

·Digital CATV
·Cable modem receivers



Pinout

  Connection Diagram


Specifications

Parameter
Symbol Test
Condition
Rating
Unit
Supply Voltage
VCC
TA=+25
6.0
V
Power Dissipation
PD
TA=+70 Note
533
mW
Operating Ambient Temperature
TA
−20 to +70
Storage Temperature
Tstg
−55 to+150
Note Mounted on double-sided copper-clad 50 * 50 *1.6 mm epoxy glass PWB


Description

The uPC3230GR is silicon bipolar monolithic IC designed for use as Dual path AGC amplifier for digital TV, Digital CATV.

This IC uPC3230GR consists of Dual path AGC amplifier for QAM path and analog one to B/B block of STB.

The package is 16-pin SSOP Package suitable for surface mount.

This IC uPC3230GR is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.

This process uses silicon nitride passivation film. This material can protect chip surface from external pollution and prevent corrosion /migration. Thus, this IC has excellent performance, uniformly and reliability.




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