Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM·MECHANICAL STRENGTH AND HEAT DISSIPATION·(Solder Voids: Typical < 2%, Max. < 10% of Die Area)·LARGE DIE FOR HIGH POWER HEAVY DUTY PERFORMANCE·HIGH HEAT HANDLING CAPABILITY WITH VERY·LOW THERMAL STRESS·PROPRIETARY JUNCTION PASSIVATION FOR·...
TPFD-6024-1A: Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM·MECHANICAL STRENGTH AND HEAT DISSIPATION·(Solder Voids: Typical < 2%, Max. < 10% of Die Area)·LARGE DIE FOR HIGH POWER HEAVY DUTY PERFORMA...
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CHARACTERISTICS | SYMBOL | RATINGS | UNIT | |
TVS6024PFC | TVS6024PFA | |||
Maximum Recurrent Peak Reverse Voltage | VRRM | 23 | 23 | VOLTS |
Maximum RMS Voltage | VRWS | 23 | 23 | VOLTS |
Maximum DC Blocking Voltage | VDC | 23 | 23 | VOLTS |
Breakdown Voltage (IR = 100 mA dc, Tc = 25 C) | V(BR) | 24 Min / 32 Max | 24 Min / 32 Max | VOLTS |
Maximum Average Forward Rectified Current @TA =55 |
IO | 60 | 60 | AMPS |
Peak Forward Surage Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load(JEDEC Method) |
IFSM | 650 | 650 | AMPS |
Repetitive Peak Reverse Surge Current (Time Constant = 10 mSec Duty Cycle < 1.0%, Tc = 25 C) | IRSM | 140 | 140 | AMPS |
Typical Thermal Resistance | RJC | 1.05 1.00 |
1.05 1.00 |
VOLTS |
Peak Instantaneous Forward Voltage Maximum (IF = 100A@ 300 mSecpulse, TC = 25 C) Typical |
VF | 200 | 200 | nA |
Maximum DC Reverse Current (VR = 20V DC, Tc = 25 C) | IR | 0.8 | 0.8 | /W |
Operating and Storage Temperature Range | Tj, TSTG | -65 to +215 | -65 to +215 |