Features: ·Glass Passivated Die Construction ·Low Forward Voltage Drop ·High Current Capability ·High Reliability·High Surge Current Capability ·Ideal for Printed Circuit Boards ·Recognized File # E157705Specifications Characteristics Symbol KBU800G KBU801G KBU802G KBU804G KBU806G KBU8...
KBU810G: Features: ·Glass Passivated Die Construction ·Low Forward Voltage Drop ·High Current Capability ·High Reliability·High Surge Current Capability ·Ideal for Printed Circuit Boards ·Recognized File # E...
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Characteristics | Symbol | KBU 800G |
KBU 801G |
KBU 802G |
KBU 804G |
KBU 806G |
KBU 808G |
KBU 810G |
UNIT |
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage |
VRRM VRWM VR |
50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
RMS Reverse Voltage | VR(RMS) | 35 | 70 | 140 | 280 | 480 | 560 | 700 | V |
Average Rectified Output Current @TC = 100°C (Note 1) |
Io | 8.0 | A | ||||||
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) |
IFSM | 300 | A | ||||||
Forward Voltage per leg @IF = 4.0A | VFM | 1.0 | V | ||||||
Peak Reverse Current @TA = 25°C At Rated DC Blocking Voltage @TA = 125°C |
IR | 10 1.0 |
A mA | ||||||
Typical Thermal Resistance per leg (Note 2) | RJA | 18 | °C/W | ||||||
Typical Thermal Resistance per leg (Note 1) | RJC | 3.0 | °C/W | ||||||
Operating Temperature Range | Tj | -65 to +150 | |||||||
Storage Temperature Range | TSTG | -65 to +150 |