Features: Mechanical Specifications Metallization Top Al - 22.5 kÅ min. Backside Au - 6.5 kÅ nom. Bonding Pad Size Emitter 5.0 mils diameter Base 5.0 mils diameter Die Thickness 8 mils nominal Chip Area 30 mils x 30 mils ...
2N3499: Features: Mechanical Specifications Metallization Top Al - 22.5 kÅ min. Backside Au - 6.5 kÅ nom. Bonding Pad Size Emitter 5.0 mils diameter ...
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Mechanical Specifications | ||
Metallization |
Top |
Al - 22.5 kÅ min. |
Backside |
Au - 6.5 kÅ nom. | |
Bonding Pad Size |
Emitter |
5.0 mils diameter |
Base |
5.0 mils diameter | |
Die Thickness |
8 mils nominal | |
Chip Area |
30 mils x 30 mils | |
Top Surface |
Silox Passivated |