Features: `Low Equivalent On Resistance`Extremely Low Saturation Voltage (150mV @1A)`hFEcharacterised up to 6A`IC=4.5A Continuous Collector Current`3mm x 2mmMLPApplication·DC - DC Converters·Charging circuits·Power switches·Motor controlPinoutSpecifications Part Number ZXTDBM832 Product ...
ZXTDBM832: Features: `Low Equivalent On Resistance`Extremely Low Saturation Voltage (150mV @1A)`hFEcharacterised up to 6A`IC=4.5A Continuous Collector Current`3mm x 2mmMLPApplication·DC - DC Converters·Chargin...
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Part Number | ZXTDBM832 |
Product Type | NPN + NPN |
VCEO(V) | 20 |
IC (A) | 4.5 |
ICM (A) | 12 |
PD (W) | 1.5 |
hFE Min | 300 200 |
hFE Max | - |
@ IC (A) | 0.2 2 |
VCE (SAT) Max (mV) | 150 270 |
@ IC (A) | 1 4.5 |
@ IB (mA) | 10 125 |
fT Min (MHz) | 100 |
RCE (SAT) (m) | 47 |
PARAMETER |
SYMBOL |
LIMIT |
UNIT |
Collector-BaseVoltage |
VCBO |
40 |
V |
Collector-EmitterVoltage |
VCEO |
20 |
V |
Emitter-BaseVoltage |
VEBO |
7.5 |
V |
PeakPulseCurrent |
ICM |
12 |
A |
ContinuousCollectorCurrent(a)(f) |
IC |
4.5 |
A |
ContinuousCollectorCurrent(b)(f) |
IC |
5 |
A |
BaseCurrent |
IB |
1000 |
mA |
PowerDissipationatTA=25 (a)(f) LinearDeratingFactor |
PD |
1.5 12 |
W mW/ |
PowerDissipationatTA=25 (b)(f) LinearDeratingFactor |
PD |
2.45 19.6 |
W mW/ |
PowerDissipationatTA=25 (c)(f) LinearDeratingFactor |
PD |
1 8 |
W mW/ |
PowerDissipationatTA=25 (d)(f) LinearDeratingFactor |
PD |
1.13 9 |
W mW/ |
PowerDissipationatTA=25 (d)(g) LinearDeratingFactor |
P D |
1.7 13.6 |
W mW/ |
PowerDissipationatTA=25 (e)(g) LinearDeratingFactor |
PD |
2 24 |
W mW/ |
OperatingandStorageTemperatureRange |
Tj:T stg |
-55 to +150 |
|
Packa ged in the inno vative 3mmx2mm MLP (Micro Leaded Package) outline ZXTDBM832,these new 4th generation low saturation dual transistor soffer extremely low on state losses making them ideal for use in DC-DC circuits and various driving and power management functions.
Additionally users gain several other key benefits: Performance capability equivalent to much largerpackges Improved circuit efficiency & power levels PCB area and device placement savings Lower package height (nom 0.9mm) Reduced component count