ZL50117

Features: General• Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks• On chip timing & synchronization recovery across a packet network• On chip dual reference Stratum 3 DPLL• Grooming capability for Nx64 Kbps trunking• Fu...

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SeekIC No. : 004551055 Detail

ZL50117: Features: General• Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks• On chip timing & synchronization recovery across a packet network̶...

floor Price/Ceiling Price

Part Number:
ZL50117
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

General
• Circuit Emulation Services over Packet (CESoP) transport for MPLS, IP and Ethernet networks
• On chip timing & synchronization recovery across a packet network
• On chip dual reference Stratum 3 DPLL
• Grooming capability for Nx64 Kbps trunking
• Fully compatible with Zarlink's ZL50110, ZL50111 and ZL50114 CESoP processors
Circuit Emulation Services
• Complies with ITU-T recommendation Y.1413
• Complies with IETF PWE3 draft standards CESoPSN and SAToP
• Complies with CESoP Implementation Agreements from MEF 8 and MFA 8.0.0
• Structured, synchronous CESoP with clock recovery
• Unstructured, asynchronous CESoP with integral per-stream clock recovery
Customer Side TDM Interfaces
• Up to 4 T1/E1, 1 J2, 1 T3/E3, or 1 STS-1 ports
• H.110, H-MVIP, ST-BUS backplane
• Up to 128 bi-directional 64 Kbps channels
• Direct connection to LIUs, framers, backplanes
Customer Side Packet Interfaces
• 100 Mbps MII Fast Ethernet (ZL50118/19/20 only) (may also be used as a second provider side packet interface)
Provider Side Packet Interfaces
• 100 Mbps MII Fast Ethernet or 1000 Mbps
GMII/TBI Gigabit Ethernet




Application

• Circuit Emulation Services over Packet Networks
• Leased Line support over packet networks
• TDM over Cable
• TDM over WiFi (802.11x)
• TDM over WiMAX (802.16)
• Fibre To The Premises G/E-PON
• Layer 2 VPN services
• Customer-premise and Provider Edge Routers and Switches
• Ethernet and IP based IADs



Specifications

Parameter Symbol Min. Max. Units
I/O Supply Voltage V DD_IO -0.5 5.0 V
Core Supply Voltage V DD_CORE -0.5 2.5 V
PLL Supply Voltage V DD_PLL -0.5 2.5 V
Input Voltage VI -0.5 VDD + 0.5 V
Input Voltage (5 V tolerant inputs) V I_5V -0.5 7.0 V
Continuous current at digital inputs IIN - ±10 mA
Continuous current at digital outputs IO - ±15 mA
Package power dissipation PD - 2.38 W
Storage Temperature TS -55 +125


* Exceeding these figures may cause permanent damage. Functional operation under these conditions is not guaranteed. Voltage measurements are with respect to ground (VSS) unless otherwise stated.
* The core and PLL supply voltages must never be allowed to exceed the I/O supply voltage by more than 0.5 V during power-up. Failure to observe this rule could lead to a high-current latch-up state, possibly leading to chip failure, if sufficient cross-supply  urrent is available. To be safe ensure the I/O supply voltage supply always rises earlier than the core and PLL supply voltages.




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