ZD5222B

Features: SpecificationsDescriptionThe ZD5222B is designed as one kind of zener diode and produced by the CYStech Electronics Corp.and is encapsulated in SOD-323 package,very suitable for low cost,low power voltage regulation application.The mechanical data of ZD5222B are:(1)case:molded plastic,JE...

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SeekIC No. : 004550564 Detail

ZD5222B: Features: SpecificationsDescriptionThe ZD5222B is designed as one kind of zener diode and produced by the CYStech Electronics Corp.and is encapsulated in SOD-323 package,very suitable for low cost,l...

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Part Number:
ZD5222B
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:






Specifications






Description

The ZD5222B is designed as one kind of zener diode and produced by the CYStech Electronics Corp.and is encapsulated in SOD-323 package,very suitable for low cost,low power voltage regulation application.The mechanical data of ZD5222B are:(1)case:molded plastic,JEDEC SOD-323;(2)terminals:solder plated,solderable per MIL-STD-750 Method 2026;(3)polarity:indicated by cathode band;(4)mounting position:any;(5)weight:0.0045 gram,0.000159 ounce.

The absolute maximum ratings(Ta=25,unless otherwise specified) of ZD5222Bcan be summarized as:(1)maximum temperatures:storage temperature(Tstg):-55 to +150 °C;(2)junction temperature(Tj):+150°C;(3)maximum power dissipation:total power dissipation Ptot(Note):200 mW;(4)derate above 25:1.57mW/;(5)thermal resistance,junction to ambient air RJA:625/W.Note:parts mounted on FR-5 board with minimum pad.

There are some important notice of ZD5222B:(1)All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek;(2)CYStek reserves the right to make changes to its products without notice;(3)CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems;(4)CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.






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