XX1000-BD

Features: ·Excellent Broadband Mixer Driver·Single Ended Fed Doubler with Distributed Buffer Amplifier·Excellent LO Driver for Mimix Receivers·+15 dBm Output Drive·100% On-Wafer RF, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vd)...

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XX1000-BD Picture
SeekIC No. : 004549648 Detail

XX1000-BD: Features: ·Excellent Broadband Mixer Driver·Single Ended Fed Doubler with Distributed Buffer Amplifier·Excellent LO Driver for Mimix Receivers·+15 dBm Output Drive·100% On-Wafer RF, DC and Output Po...

floor Price/Ceiling Price

Part Number:
XX1000-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

·Excellent Broadband Mixer Driver
·Single Ended Fed Doubler with Distributed Buffer Amplifier
·Excellent LO Driver for Mimix Receivers
·+15 dBm Output Drive
·100% On-Wafer RF, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010





Specifications

Supply Voltage (Vd)

Supply Voltage (Vss)

Supply Current (Id)

Supply Current (Iss)

Gate Bias Voltage (Vg)

Input Power (RF Pin)

Storage Temperature (Tstg)

Operating Temperature (Ta)

Channel Temperature (Tch)
+6.0 VDC

-6.0 VDC

300 mA

60 mA

+0.3 VDC

+12.0 dBm

-65 to +165

-55 to MTTF Table 1

MTTF Table 1

(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's single ended fed (no external balun required) 7.5-25.0/15.0-50.0 GHz GaAs MMIC doubler has a +15.0 dBm output drive and is an excellent LO doubler that can be used to drive fundamental mixer devices. It is also well suited to drive Mimix's XR1002 receiver device. This XX1000-BD MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The XX1000-BD chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.






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