XU1004

Features: ·Sub-harmonic Transmitter·Integrated Mixer, LO Doubler/Buffer & Output Amplifier·+14.0 dBm Output Third Order Intercept (OIP3)·+4.0 dBm LO Drive Level·5.0 dB Conversion Gain·100% On-Wafer RF and DC Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Vo...

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XU1004 Picture
SeekIC No. : 004549629 Detail

XU1004: Features: ·Sub-harmonic Transmitter·Integrated Mixer, LO Doubler/Buffer & Output Amplifier·+14.0 dBm Output Third Order Intercept (OIP3)·+4.0 dBm LO Drive Level·5.0 dB Conversion Gain·100% On-Wa...

floor Price/Ceiling Price

Part Number:
XU1004
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/24

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Product Details

Description



Features:

·Sub-harmonic Transmitter
·Integrated Mixer, LO Doubler/Buffer & Output Amplifier
·+14.0 dBm Output Third Order Intercept (OIP3)
·+4.0 dBm LO Drive Level
·5.0 dB Conversion Gain
·100% On-Wafer RF and DC Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd)

Supply Current (Id1,Id2)

Gate Bias Voltage (Vg)

Input Power (IF Pin)

Storage Temperature (Tstg)

Operating Temperature (Ta)

Channel Temperature (Tch)
+6.0 VDC

200, 180 mA

+0.3 VDC

0.0 dBm

-65 to +165

-55 to MTTF Table3

MTTF Table3



Description

Mimix Broadband's 32.0-45.0 GHz GaAs MMIC transmitter has a +14.0 dBm output third order intercept across the band. This XU1004 device is a balanced, resistive pHEMT mixer followed by a distributed output amplifier and includes an integrated LO doubler and LO buffer amplifier. The use of integrated LO doubler and LO buffer amplifier makes the provision of the LO easier than for fundamental mixers at these frequencies. IF and IF mixer inputs are provided and an external 180 degree hybrid is required to select the desired sideband. This XU1004 MMIC uses Mimix Broadband's 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This XU1004 device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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