XRT73L03B

NOTE: The XRT73L03B is assembled in a thermally enhanced package with an integral Copper Heat Slug. The Heat Slug is solder plated and is exposed on the bottom of the package and is electrically connected to the internalGND connections of the device. This Heat Slug can be soldered to the mounting board if desired, but must be electrically isolated from any V_DDconnections.

The XRT73L03B, 3-Channel, DS3/E3/STS-1 Line In-terface Unit is a low power CMOS version of the XRT73L03A and consists of three independent line transmitters and receivers integrated on a single chip designed for DS3, E3 or SONET STS-1 applications.

Each channel of the XRT73L03B can be configured to support the E3 (34.368 Mbps), DS3 (44.736 Mbps) or the SONET STS-1 (51.84 Mbps) rates. Each channel can be configured to operate in a mode/data rate that is independent of the other channels.

In the transmit direction, each channel encodes input data to either B3ZS (DS3/STS-1) or HDB3 (E3) for-mat and converts the data into the appropriate pulse shapes for transmission over coaxial cable via a 1:1 transformer.

In the receive direction, the XRT73L03B performs equalization on incoming signals, performs Clock Recovery, decodes data from either B3ZS or HDB3 for-mat, converts the receive data into TTL/CMOS for-mat, checks for LOS or LOL conditions and detects and declares the occurrence of Line Code Violations.