XRD98L62

VDD to GND........................ +7.0V
VRT & VRB................ V_DD +0.5 to GND -0.5V
VIN ................ ...V_DD +0.5 to GND -0.5V
All Inputs........... ..... V_DD +0.5 to GND -0.5V
All Outputs............ .... V_DD+0.5 to GND -0.5V
Storage Temperature ........... ..-65°C to 150°C
Lead Temperature (Soldering 10 seconds) ........300°C
Maximum Junction Temperature ........... ..150°C
Package Power Dissipation Ratings (T_A= +70°C)
TQFP _JA = .......................105°C/W
ESD .................... ........2000V
Notes:
1 Stresses above those listed as "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps from input pin to the supplies. All inputs have protection diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100s.
3 V_DD refers to AV_DD, OV_DD and DV_DD. GND refers to AGND, OGND and DGND.