XRD5412

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V, +7V
Digital Input Voltage to GND . . . . . .-0.3V, VDD +0.3V
VREFIN . . . . . . . . . . . . . . . . . . . . . . . .-0.3V, VDD +0.3V
VOUT¹ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDD, GND
Continuous Current, Any Pin . . . . . . . . -20mA, +20mA
Package Power Dissipation Ratings (T_A= +70)
PDIP (derate 9mW/above +70) . . . 117mW
SOIC (derate 6mW/ above +70) . . .155mW
Operating Temperature Range . . . . . -40 to + 85
Storage Temperature Range . . . . . . -65 to +165
Lead Temperature (soldering, 10 sec) . . . . . . +300
Notes
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100ms.