Features: • 0.22 µm 5-layer epitaxial process• QML certified• Radiation hardened FPGAs for space and satellite applications• Guaranteed total ionizing dose to 100K Rad(si)• Latch-up immune to LET = 125 MeV cm2/mg• SEU immunity achievable with recommended r...
XQVR1000: Features: • 0.22 µm 5-layer epitaxial process• QML certified• Radiation hardened FPGAs for space and satellite applications• Guaranteed total ionizing dose to 100K Rad(...
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DescriptionThe XQVR300-4CB228M is designed as one kind of high-performance, high-capacity programm...
• 0.22 µm 5-layer epitaxial process
• QML certified
• Radiation hardened FPGAs for space and satellite applications
• Guaranteed total ionizing dose to 100K Rad(si)
• Latch-up immune to LET = 125 MeV cm2/mg
• SEU immunity achievable with recommended redundancy implementation
• Guaranteed over the full military temperature range (55 to +125)
• Fast, high-density Field-Programmable Gate Arrays
- Densities from 100k to 1M system gates
- System performance up to 200 MHz
- Hot-swappable for Compact PCI
• Multi-standard SelectI/O™ interfaces
- 16 high-performance interface standards
- Connects directly to ZBTRAM devices
• Built-in clock-management circuitry
- Four dedicated delay-locked loops (DLLs) for advanced clock control
- Four primary low-skew global clock distribution nets, plus 24 secondary global nets
• Hierarchical memory system
- LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register
- Configurable synchronous dual-ported 4k-bit RAMs
- Fast interfaces to external high-performance RAMs
• Flexible architecture that balances speed and density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensing device
• Supported by FPGA Foundation™ and Alliance Development Systems
- Complete support for Unified Libraries, Relationally Placed Macros, and Design Manager
- Wide selection of PC and workstation platforms
• SRAM-based in-system configuration
- Unlimited reprogrammability
- Four programming modes
• Available to Standard Microcircuit Drawings. Contact Defense Supply Center Columbus (DSCC) for more information at http://www.dscc.dla.mil
- 5962-99572 for XQVR300
- 5962-99573 for XQVR600
- 5962-99574 for XQVR1000
Symbol | Description | Min/Max | Units | |
VCCINT | Supply voltage relative to GND | 0.5 to 3.0 | V | |
VCCO | Supply voltage relative to GND | 0.5 to 4.0 | V | |
VREF | Input reference voltage | 0.5 to 3.6 | V | |
VIN(3) | Input voltage relative to GND | Using VREF | 0.5 to 3.6 | V |
Internal threshold | 0.5 to 5.5 | V | ||
VTS | Voltage applied to 3-state output | 0.5 to 5.5 | V | |
VCC | Longest supply voltage rise time from 1V to 2.375V | 50 | ms | |
TSTG | Storage temperature (ambient) | 65 to +150 | ||
TJ | Junction temperature | +150 |