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XQ4005E

Features: • Certified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing)• Also available under the following Standard Microcircuit Drawings (SMD) - XC4005E 5962-97522 - XC4010E 5962-97523 - XC4013E 5962-97524 - XC4025E 5962-97525 - XC4028EX 5962-98509• For more in...

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SeekIC No. : 004549113 Detail

XQ4005E: Features: • Certified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing)• Also available under the following Standard Microcircuit Drawings (SMD) - XC4005E 5962-97522 - X...

XQ4005E Data Sheet

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Part Number:
XQ4005E
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Certified to MIL-PRF-38535, appendix A QML (Qualified Manufacturers Listing)
• Also available under the following Standard Microcircuit Drawings (SMD)
- XC4005E 5962-97522
- XC4010E 5962-97523
- XC4013E 5962-97524
- XC4025E 5962-97525
- XC4028EX 5962-98509
• For more information contact the Defense Supply Center Columbus (DSCC)
• System featured Field-Programmable Gate Arrays
- Select-RAMTM memory: on-chip ultra-fast RAM with
` Synchronous write option
` Dual-port RAM option
- Abundant flip-flops
- Flexible function generators
- Dedicated high-speed carry logic
- Wide edge decoders on each edge
- Hierarchy of interconnect lines
- Internal 3-state bus capability
- Eight global low-skew clock or signal distribution networks
• System Performance beyond 60 MHz
• Flexible Array Architecture
• Low Power Segmented Routing Architecture
• Systems-Oriented Features
- IEEE 1149.1-compatible boundary scan logic support
- Individually programmable output slew rate
- Programmable input pull-up or pull-down resistors
- 12 mA sink current per XQ4000E/EX output
• Configured by Loading Binary File
- Unlimited reprogrammability
• Readback Capability
- Program verification
- Internal node observability
• Backward Compatible with XC4000 Devices
• Development System runs on most common computer platforms
- Interfaces to popular design environments
- Fully automatic mapping, placement and routing
- Interactive design editor for design optimization
• Available Speed Grades:
- XQ4000E    -3 for plastic packages only
-                   -4 for ceramic packages only
- XQ4028EX  -4 for all packages


Specifications

Symbol Description Value Units
VCC Supply voltage relative to GND 0.5 to +7.0 V
VIN Input voltage with respect to GND 0.5 to VCC + 0.5 V
VTS Voltage applied to High-Z output 0.5 to VCC + 0.5 V
VCCt Longest supply voltage rise time from 1V to 4V 50 ms
TSTG Storage temperature (ambient) 65 to +150
TSOL Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm) +260
TJ Junction temperature Ceramic package +150
Plastic package +125


Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2. Maximum DC excursion above VCC or below Ground must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to 2.0V or overshoot to VCC + 2.0V, provided this over or undershootlasts less than 10 ns and with the forcing current being limited to 200 mA.


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