XQ1006-BD

Features: ·On-Chip Prescaler·+5.0 dBm Output Power·-35 dBc Harmonic Suppression·-88 dBc/Hz @ 100KHz Phase Noise·110mA @ 4.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010 Specifications Supply Voltage (Vcc1,2,3)Supply Voltage (Vtune)S...

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SeekIC No. : 004549104 Detail

XQ1006-BD: Features: ·On-Chip Prescaler·+5.0 dBm Output Power·-35 dBc Harmonic Suppression·-88 dBc/Hz @ 100KHz Phase Noise·110mA @ 4.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspec...

floor Price/Ceiling Price

Part Number:
XQ1006-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·On-Chip Prescaler
·+5.0 dBm Output Power
·-35 dBc Harmonic Suppression
·-88 dBc/Hz @ 100KHz Phase Noise
·110mA @ 4.0V Bias Supply
·100% On-Wafer, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010





Specifications

Supply Voltage (Vcc1,2,3)

Supply Voltage (Vtune)

Supply Current (Icc1,2,3)

Supply Current (Itune)

Storage Temperature (Tstg)

Operating Temperature (Ta)

Junction Temperature (Tjn)
+5.0 VDC

+7.0 VDC

150 mA

1 mA

-65 to +165

-55 to MTTF Table

MTTF Table
(1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

XQ1006-BD Mimix Broadband's 14.7-15.7 GHz GaAs HBT VCO is a fully integrated oscillator MMIC with on-chip frequency doubler and divide-by-8 prescaler (w.r.t RFout). This design is based on a cross coupled differential pair with on-chip tuning diode and resonator. The use of a high-Q resonator structure and integrated varactor diodes results in optimum phase-noise performance, whilst the integration of frequency doubler and prescaler reduce application complexity and time-to-market. This MMIC uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure low flicker (1/f ) noise and high reliability. The XQ1006-BD chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.






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