XPC850

The XPC850 is assembled in a 256 leaded plastic ball grid array.It is assembled in a 357 lead plastic ball grid array (PBGA).Both packages have been shown to meet level 3 moisture sensitivity as classified by JEDEC A113.Our volume production is manufactured in Motorola's Kuala Lumpur, Malaysia facility, however we have also qualified Citizen Watch Co, in Japan as an alternate assembly site.

XPC850 are currently in their XC phase of product life,which is the
time when design errata are discovered and corrected.Although the 850 and 860 are still classified as XC devices,they are built using production equipment and processes,and have completed their reliability qualifications.There are some functional errata on these devices,which may impact some customers.These errata are expected to be corrected in revision D of the 860, which we expect to grant MC status to.For a list of current design errata on these devices, please contact your local Motorola sales person. To locate the nearest sales office,you can find them on our website at http://mot-sps.com/sales/sales_web.html.

This stress is performed to accelerate infant mortality failure mechanisms,which are defects that occur within the first year of normal device operation.The typical stress condition is a temperature of 125°C,a voltage of 6V for 5V products and 4.5V for 3.3V products,and a duration of 168 hours.Devices used in this test are sampled directly after the standard production final test flow with no prescreening,unless called out in the normal production flow.