XP1019-BD

Features: Excellent Transmit Output StageTemperature Compensated Output Detector18.0 dB Small Signal Gain+27.0 dBm P1dB Compression Point100% On-Wafer RF, DC and Output Power Testing100% Visual Inspection to MIL-STD-883Method 2010Specifications Supply Voltage (Vd) +6.0 VDC Supply Curren...

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SeekIC No. : 004548905 Detail

XP1019-BD: Features: Excellent Transmit Output StageTemperature Compensated Output Detector18.0 dB Small Signal Gain+27.0 dBm P1dB Compression Point100% On-Wafer RF, DC and Output Power Testing100% Visual Insp...

floor Price/Ceiling Price

Part Number:
XP1019-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Description



Features:

Excellent Transmit Output Stage
Temperature Compensated Output Detector
18.0 dB Small Signal Gain
+27.0 dBm P1dB Compression Point
100% On-Wafer RF, DC and Output Power Testing
100% Visual Inspection to MIL-STD-883
Method 2010





Specifications

Supply Voltage (Vd) +6.0 VDC
Supply Current (Id1,2,3) 145, 290, 580 mA
Gate Bias Voltage (Vg) +0.3 VDC
Input Power (Pin) +19.0dBm
Storage Temperature (Tstg) -65 to +165
Operating Temperature (Ta) -55 to MTTF Table1
Channel Temperature (Tch) MTTF Graph1
(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's XP1019-BD three stage 17.0-24.0 GHz GaAs MMIC buffer amplifier has a small signal gain of 18.0 dB with a +27.0 dBm P1dB output compression point across much of the band. The device also includes an on-chip temperature compensated output power detector. This MMIC XP1019-BD uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. XP1019-BD is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.






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