XCV300-4FG456C

IC FPGA 2.5V C-TEMP 456-FBGA

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XCV300-4FG456C Picture
SeekIC No. : 003498047 Detail

XCV300-4FG456C: IC FPGA 2.5V C-TEMP 456-FBGA

floor Price/Ceiling Price

Part Number:
XCV300-4FG456C
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Product Details

Quick Details

Series: Virtex® Manufacturer: Xilinx Inc
Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536 THD plus Noise : 2 %
Number of I /O: 312 Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C Package / Case: 456-BBGA    

Description

Total RAM Bits: 65536
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 2.375 V ~ 2.625 V
Manufacturer: Xilinx Inc
Package / Case: 456-BBGA
Supplier Device Package: 456-FBGA
Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Number of I /O: 312
Series: Virtex®
Number of Gates: 322970


Description

The XCV300-4FG456C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 mm CMOS process. These advances make Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays.

The features of XCV300-4FG456C are: (1)Fast, high-density Field-Programmable Gate Arrays; (2)Multi-standard SelectIO. interfaces; (3)Built-in clock-management circuitry; (4)Hierarchical memory system; (5)Flexible architecture that balances speed and density; (6)Supported by FPGA Foundation. and Alliance Development Systems; (7)SRAM-based in-system configuration; (8)0.22mm 5-layer metal process; (9)100% factory tested.




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