XCS30-3TQ144I

Mounting Type: Surface Mount
Total RAM Bits: 18432
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)
Operating Temperature: -40°C ~ 100°C
Number of Gates: 30000
Voltage - Supply: 4.5 V ~ 5.5 V
Number of I /O: 113
Manufacturer: Xilinx Inc
Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Series: Spartan®


Pinout




Description

The XCS30-3TQ144I is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates.

Features of the XCS30-3TQ144I are:(1)first ASIC replacement FPGA for high-volume production with on-chip RAM;(2)density up to 1862 logic cells or 40,000 system gates;(3)streamlined feature set based on XC4000 architecture;(4)system performance beyond 80 MHz;(5)broad set of AllianceCORE and LogiCORE predefined solutions available;(6)unlimited reprogrammability;(7)low cost;(8)system level features;(9)fully supported by powerful Xilinx development system.

The absolute maximum ratings of the XCS30-3TQ144I can be summarized as:(1):the characteristics is supply voltage relative to GND,the symbol is VCC,the value is 0.5 to +7.0,the unit is V;(2):the characteristics is input voltage relative to GND,the symbol is VIN,the value is 0.5 to VCC +0.5,the unit is V;(3):the characteristics is voltage applied to 3-state output,the symbol is VTS,the value is 0.5 to VCC +0.5,the unit is V;(4):the characteristics is storage temperature (ambient),the symbol is Tstg,the value is -65 to +150,the unit is ;(5):the characteristics is junction temperature plastic packages,the symbol is TJ,the value is +125,the unit is .