Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 3750VRMS Input/Output Isolation• No EMI/RFI Generation• Machine Insertable, Wave Solderabl...
XCB170: Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 37...
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US $36.18 - 44.6 / Piece
Multi-Conductor Cable 24AWG 1PR PVC 1000ft BL/WH-WH/BL
Parameter | Min | Typ | Max | Units |
Input Power Dissipation | - | - | 1501 | mW |
Input Control Current Peak (10ms) |
- - |
- | 50 1 |
mA A |
Reverse Input Voltage | - | - | 5 | V |
Total Power Dissipation | - | - | 8002 | mW |
Isolation Voltage Input to Output |
3750 | - | - | VRMS |
Operational Temperature | -40 | - | +85 | |
Storage Temperature | -40 | - | +125 | |
Soldering Temperature DIP Package Surface Mount Package (10 Seconds Max.) |
- - |
- | +260 +220 |
The XCB170 is a 1-Form-B relay which uses optically coupled MOSFET technology to provide 3750V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare's patented OptoMOS® architecture. A highly efficient GaAIAs infrared LED controls the optically coupled input. The XCB170 device is available in small 6-pin dual in line package in standard through hole and surface mount lead bend.