Position: Home  > All Categories> Integrated Circuits (ICs) > XCB170

XCB170

Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 3750VRMS Input/Output Isolation• No EMI/RFI Generation• Machine Insertable, Wave Solderabl...

product image

XCB170 Picture
See larger image
SeekIC No. : 004548095 Detail

XCB170: Features: • Small 6 Pin DIP Package• Low Drive Power Requirements (TTL/CMOS Compatible)• No Moving Parts• High Reliability• Arc-Free With No Snubbing Circuits• 37...

XCB170 Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
XCB170
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/12/21

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

• Small 6 Pin DIP Package
• Low Drive Power Requirements (TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• 3750VRMS Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount and Tape & Reel Versions Available


Application

• UL Recognized: File Number E76270
• CSA Certified: File Number LR 43639-10
• BSI Certified to:
• BS EN 60950:1992 (BS7002:1992) Certificate #: 7344
• BS EN 41003:1993 Certificate #: 7344


Specifications

Parameter Min Typ Max Units
Input Power Dissipation - - 1501 mW
Input Control Current
Peak (10ms)		 -
-		 - 50
1		 mA
A
Reverse Input Voltage - - 5 V
Total Power Dissipation - - 8002 mW
Isolation Voltage
Input to Output		 3750 - - VRMS
Operational Temperature -40 - +85
Storage Temperature -40 - +125
Soldering Temperature
DIP Package
Surface Mount Package
(10 Seconds Max.)		 -
-		 - +260
+220



Description

The XCB170 is a 1-Form-B relay which uses optically coupled MOSFET technology to provide 3750V of input to output isolation. The efficient MOSFET switches and photovoltaic die use Clare's patented OptoMOS® architecture. A highly efficient GaAIAs infrared LED controls the optically coupled input. The XCB170 device is available in small 6-pin dual in line package in standard through hole and surface mount lead bend.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
LED Products
LM24P20
KCG057QV1DB-G770
Sensors, Transducers
GP2Y0D340K
PAN3509DH-TXWA
Power Supplies - Board Mount
HC-06
PM150RSA060-S81AH0G
Crystals and Oscillators
WT325BI0030.000000
2SB49
Inductors, Coils, Chokes
DR127-330-R
SD53-100-R
RF and RFID
X3C26P1-30S
1P620S
View more