XC4VSX25-10FFG668C

Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Manufacturer: Xilinx Inc
Package / Case: 668-BBGA, FCBGA
Supplier Device Package: 668-FCBGA
Number of I /O: 320
Number of LABs/CLBs: 2560
Series: Virtex®-4 SX
Number of Logic Elements/Cells: 23040
Total RAM Bits: 2359296


Description

 

The XC4VSX25-10FFG668C is designed as the Xilinx introduces the platform flash series of in-system programmable configuration PROMs. It can be used in 1 to 32 megabit (Mbit) densities. This device includes both the 3.3V XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS version includes 4-Mbit, 2-Mbit, and 1-Mbit PROMs that support Master Serial and Slave Serial FPGA configuration modes.

Features of the XC4VSX25-10FFG668C are:(1)cascadable for storing longer or multiple bitstreams;(2)dedicated boundary-scan (JTAG) I/O power supply;(3)I/O pins compatible with voltage levels ranging from 1.5V to 3.3V;(4)design support using the Xilinx alliance ISE and foundation ISE series software pack-ages;(5)JTAG command initiation of standard FPGA configuration;(6)operation over full industrial temperature range (-40°C to +85°C);(7)endurance of 20,000 program/erase cycles;(8)low-power advanced CMOS NOR FLASH process;(9)serial FPGA configuration interface (up to 33 MHz);(10)3.3V supply voltage.

The absolute maximum ratings of the XC4VSX25-10FFG668C can be summarized as:(1)internal supply voltage relative to GND:-0.5 to +4.0;(2)I/O supply voltage relative to GND:-0.5 to +4.0;(3)JTAG I/O supply voltage relative to GND:-0.5 to +4.0;(4)storage temperature (ambient):-65 to +150 °C;(5)junction temper-ature:+125 °C;(6)input voltage with respect to GND (Vcco < 2.5V):-0.5 to +3.6 V;(7)input voltage with respect to GND (Vcco 2.5V):-0.5 to +5.5 V:.If you want to know more information such as the electrical characteristics about the XC4VSX25-10FFG668C,please download the datasheet in www.seekic.com or www.chinaicmart.com .