XC4VLX100-12FF1148I

DescriptionThe XC4VLX100-12FF1148I is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL column-based architecture is unique in the programmable logic industry. A wide array of hard-IP core blocks complete the system solution. These cores include the Pow...

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XC4VLX100-12FF1148I: DescriptionThe XC4VLX100-12FF1148I is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL column-based architecture is unique in the programmable logic ind...

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Part Number:
XC4VLX100-12FF1148I
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/20

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Description



Description

The XC4VLX100-12FF1148I is the newest generation FPGA from Xilinx. The innovative Advanced Silicon Modular Block or ASMBL column-based architecture is unique in the programmable logic industry. A wide array of hard-IP core blocks complete the system solution. These cores include the PowerPC processors (with a new APU interface),Tri-Mode Ethernet MACs, 622 Mb/s to 11.1 Gb/s serial transceivers, voltage/temperature system monitor blocks,dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4 building blocks are an enhancement of those found in the popular Virtex-based product families: Virtex, Virtex-E, Virtex-II,Virtex-II Pro, and Virtex-II Pro X, allowing upward compatibility of existing designs. XC4VLX100-12FF1148I devices are produced on a state-of-the-art 90-nm copper process, using 300 mm (12 inch) wafer technology. Combining a wide variety of flexible features, the XC4VLX100-12FF1148I enhances programmable logic design capabilities and is a powerful alternative to ASIC technology.

Features of the XC4VLX100-12FF1148I are:(1)high-performance logic applications solution;(2)Xesium clock technology;(3)XtremeDSP slice;(4)smart RAM memory hierarchy;(5)selectIO technology;(6)flexible logic resources;(7)built-in system monitor (voltage/temp. measurement);(8)10-bit, 200kSPS A/D converter (ADC);(9)secure chip AES bitstream encryption;(10)90-nm copper CMOS process;(11)1.2V core voltage;(12)flip-chip packaging.




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